Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...

At the 46th Design Automation Conference in San Francisco last month, attention turned to a discussion of how to extend the momentum of Moore’s Law into the next decade. One plausible solution, ...

The global polymer 3D printing market is entering a period of accelerated expansion, with its value projected to rise from ...

Dublin, Jan. 31, 2024 (GLOBE NEWSWIRE) -- The "Global 3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid ...

In recent years, computer chip performance has bumped up against the physical limitations of the space available on ...

CEA-Leti scientists presented three papers at the IEEE Symposium on VLSI Technology and Circuits detailing the institute's progress on 3D integration technologies, which are a promising approach for ...

Professor Tim Cheng adn Dimitri Strukov at the University of California at Santa Barbara described how 3-D techniques could realize the dream of semiconductor memristors. Using a hybrid 3-D ...

Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA ...