So, you’ve probably heard about flip chip IC technology, maybe in passing or maybe you’re knee-deep in a project that needs it. It’s this pretty neat way of putting computer chips onto circuit boards.

Gold-on-gold stud-bumps comprise a connection technique used in some microminiature flip-chip assemblies: (a) shows bumps on an IC; (b) is a close-up view. Flip-chip processes allow miniaturization of ...

On the 14th, Hanwha Semitech signed a TC bonder (thermal compression bonding equipment) supply contract with SK Hynix worth 21 billion KRW. The semiconductor industry generally considers this not to ...

Editor’s preface: There is increasing interest in the ‘new’ smart card chip manufacturing technique known as Flip Chip. An alternative to the tradional manufacturing process that attached chips to ...