Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and ...
HyperLight Corporation ("HyperLight"), creator of the TFLN Chiplet(TM) Platform, today announced the availability of 400G-per-lane thin-film lithium niobate (TFLN) photonic integrated circuits (PICs) ...
Multi-die design teams should adopt modular principles, utilize proven IP blocks with D2D support, and implement automated ...
Why chiplets and why now? A special section at EDN provides a detailed treatment of this revolutionary silicon technology ...
TIER IV, the pioneering force behind open-source software for autonomous driving, has officially joined the Automotive Chiplet Program (ACP) overseen by imec, a world-leading research and innovation ...
The awards spotlight application acceleration, packaging, die-to-die interfaces, and other key technical areas. Chiplet Summit, the premier global event focused on chiplet-based design and integration ...
For decades, monolithic system-on-chip (“SoC”) designs defined the semiconductor landscape. Introduced in the 1970s[1] and refined over several generations, SoCs allowed designers to integrate ...
A new technical paper, “Link Quality Aware Pathfinding for Chiplet Interconnects,” was published by researchers at UCLA. Abstract “As chiplet-based integration advances, designers must select among ...
SANTA CLARA, Calif., February 02, 2026--(BUSINESS WIRE)--Chiplet Summit, the biggest conference totally dedicated to chiplets, today announced the keynotes for its fourth annual event, February 17-19, ...
Chiplet Summit, the biggest chiplet show ever, announces its pre-conference day schedule. It will occur on Tuesday, February 17, at the Santa Clara Convention Center, ahead of the main event taking ...
What design considerations are there for 3D IC packaging? How do issues like thermal design differ with 3D IC packages? 3D IC ...
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