US President Joe Biden arrives for a ceremony at the groundbreaking of the Intel semiconductor manufacturing facility near New Albany, Ohio in 2022. He will be in Arizona late today. The U.S.

Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Absolics says its facility can currently produce a maximum of 12,000 square meters of glass panels a year. That’s enough, Lee ...

South Korea increased its aid package for the semiconductor industry to 33T won (about $23.25B) from the 26T won package introduced last year, Reuters reported. The move comes after calls to the ...

SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...

The issue of MEMS-based system solutions and their packaging will be addressed at the MEMS Industry Group’s annual MEMS Executive Congress, which will be held in Scottsdale AZ on November 3-5, 2010, ...

Every time we hear of a semiconductor company making a breakthrough in package size through some form of 3D transistor, 3D wafer stacking, or flip-chip packaging, the primary driver is assumed to be ...

In the arena of business ethics, the phrase "do no harm" is central to the ideal of how businesses should conduct themselves. Variations on the theme such as "do no evil," adopted by Google's ...