Draper and the Northeast Microelectronics Coalition (NEMC) today announced that Draper will provide advisory services and support to startups and small companies within NEMC's membership to de-risk ...

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. By Don Clark Reporting from ...

Achieving the circuit densities we need for the next generation of electronics demands advanced packaging and chip-scale interconnect solutions. The need to look for alternative packaging solutions to ...

AI agents capable of handling large portions of chip design and verification are less about convenience and more about maintaining a competitive edge globally.

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Average Al chip-package size to triple by 2030 for more memory and computing cores Advanced packaging is becoming a core driver of semiconductor performance and profitability as artificial ...

Forbes contributors publish independent expert analyses and insights. Dave Altavilla is a Tech Analyst covering chips, compute and AI. In a joint announcement reflecting the growing importance of ...

Apple is gearing up to use TSMC's latest SoIC advanced packaging technologies for its next-generation M5 chips as part of a two-pronged strategy for the company to power its future Macs and AI servers ...

The A20 chip that will be used in the iPhone 18 could be packaged with a new tech that will give Apple more configuration options, while still being as small as possible. Apple's chips, produced by ...

"Our continued collaboration with Synopsys enables engineering teams to accelerate 'systems of chips' innovation utilizing our unique systems foundry capabilities and optimized Synopsys EDA flows and ...

Huawei is preparing an ambitious leap in chip design that could disrupt Nvidia's dominance of the artificial intelligence hardware market. Newly surfaced patent filings from mid-2025 detail a four-die ...