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Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
At this week's HotChips 34 conference, Intel CEO Pat Gelsinger laid out his company's vision for the future, and a cornerstone of that vision is advanced packaging combining multiple chiplets. That's ...
Intel Wednesday demonstrated its revolutionary three-dimensional (3-D) Tri-Gate transistor technology in a 22-nm microprocessor, code-named Ivy Bridge, that is already being used in prototype laptops, ...
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