Syracuse, N.Y. – When Micron Technology’s massive semiconductor plant opens in Clay a few years from now, it will be anchored by some of the most advanced and complex technology ever invented. The ...
JTEKT Toyoda Americas recently demonstrated a new double-disc horizontal grinder – calling it “an industry first” – that simultaneously grinds both sides of silicon wafers to +/- 1 micron from ...
Hosokawa Micron has announced the development of a high-performance cooling type mechanical mill, the Micron Glacis GC fine-grinding mill. Suitable for fine grinding of heat-sensitive products, the ...
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