Morningstar

THine Announces Its Optical DSP-Free Chipset, Best Suited for “Slow And Wide” Interconnection in Scale-Up AI Networks of the Next Generation

THine Announces Its Optical DSP-Free Chipset, Best Suited for “Slow And Wide” Interconnection in Scale-Up AI Networks of the Next Generation ZERO EYE SKEW® Technology Can Achieve Cost-Effective ...
TMCnet

From Interconnect to Power and Thermal Management: Luxshare-ICT Expands Its Role in AI Data Center Infrastructure

As artificial intelligence moves from model training into broader commercial deployment, the underlying data center architecture is changing rapidly. Higher computing density, faster interconnect ...
YDR

MWC 2026 | Hengtong Unveils ‘Fiber Lane + AI Brain’ to Forge a New Foundation for Global AI Computing Interconnection

SHANGHAI, SHANGHAI, CHINA, March 6, 2026 /EINPresswire.com/ — At the Mobile World Congress (MWC 2026) held in Barcelona, Spain, Hengtong made a significant impact ...
Yahoo Finance

THine Announces Its Optical DSP-Free Chipset, Best Suited for "Slow And Wide" Interconnection in Scale-Up AI Networks of the Next Generation

ZERO EYE SKEW ® Technology Can Achieve Cost-Effective Short-Reach PCIe7 2TB/s, Supporting High-Density VCSEL and Photodiode Arrays, Lowering Latency by 90%, Saving Power by 73% These VCSEL drivers and ...
Business Wire

THine Announces Its Optical DSP-Free Chipset, Best Suited for “Slow And Wide” Interconnection in Scale-Up AI Networks of the Next Generation

TOKYO--(BUSINESS WIRE)--THine Electronics, Inc. (Tokyo Stock Exchange:6769, “THine”), a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as ...