An examination of coupled predictive simulations of thermoforming processes and drop-impact loading in package design. Balakrishna Haridas and Clinton A. Haynes Thermoformed packaging is widely used ...
Consumer electronics – tablets, smartphones and e-readers – is now leading the industry in growth. For system manufacturers and integrated circuit (IC) suppliers, the challenge involves keeping pace ...
LANCASTER, Calif.--(BUSINESS WIRE)--Simulations Plus, Inc. (Nasdaq: SLP), a leading provider of modeling and simulation software and services for pharmaceutical safety and efficacy, today announced ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
According to The State of Thermal, an industry-wide survey of over 170 thermal engineers conducted by simulation software vendor 6SigmaET, thermal engineers are increasingly frustrated with the ...
Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leadin ...
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