The packaging of products is one of the most important aspects for every company. Well-thought-out and planned packaging techniques can inhibit or enhance sales. It is financially burdensome to a ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

LONDON--(BUSINESS WIRE)--According to the latest market study released by Technavio, the global semiconductor assembly equipment market is projected to grow to USD 5.04 billion by 2021, at a CAGR of ...

Photonic integrated circuits (PICs) are compact devices that combine multiple optical components on a single chip. They have a wide range of applications in communications, ranging, sensing, computing ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...

Wouldn’t the packaging for a big-screen TV be the perfect size for a TV stand? Yes, and a clever designer decided to do just that. We knew there were some tricky designers working on various packaging ...

Forward-looking: The Department of Commerce has announced $1.4 billion in awards through the CHIPS National Advanced Packaging Manufacturing Program. While this initiative will contribute to making ...