Figure 1. A model INL 8 layer metal network assembled from M1, M2, and M4 layers from a 32nm CMOS logic circuit. The INL is fabricated on a Si substrate by 32nm capable BEOL tool sets. The total ...
Over the past nine years, SiGen has been quietly developing and working with partners to apply its process and equipment technology to Three Dimensional Integrated Circuit (3DIC) stacking. SiGen is ...
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