Frore Systems today announced it has achieved Unicorn status following the close of a $143 million Series D financing round, ...
To overcome the thermal barriers limiting AI performance, Frore Systems today unveiled LiquidJet(TM) Nexus, a new integrated liquid cooling system designed for the AI era. As AI compute densities ...
Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
On the sidelines of the 7th CII Datacenter Blueprint Summit, Refroid Technologies, the pioneer in high-density thermal engineering, and TierX Datacenters, a leader in rapid-deployment modular ...
Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...