Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...
Thermal-induced stress is now one of the leading causes of transistor failures, and it is becoming a top focus for chipmakers as more and different kinds of chips and materials are packaged together ...
A group of researchers led by Helmholtz-Zentrum Berlin (HZB) in Germany and China’s Henan University investigated repeated thermal stress cycles, reflecting diurnal cycles, on the degradation of metal ...
Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors and other microelectronic and optoelectronic ...
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