As scaled-down circuits with limited functions redefine computing for AI, their flexibility requires a new approach to securing critical infrastructure.

As part of today’s MacBook Pro update, Apple has also unveiled the M5 Pro and M5 Max, the newest members of the M5 chip ...

Panelists repeatedly highlighted that AI compute scaling is dramatically outpacing traditional Moore’s Law transistor ...

Chiplets—discrete semiconductor components co-designed and manufactured separately before being integrated into a larger system—are emerging as a groundbreaking approach to addressing many of the ...

The tool aims to ease the challenges of designing intricate 3D interconnects, offering engineers a way to handle multi-die ...

The fourth annual Chiplet Summit, the largest conference dedicated to chiplets, today reported on its 2026 Best of Show Awards at the Santa Clara Convention Center. The winners are: ...

The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...

A Reasoning Processing Unit”. Abstract “Large language model (LLM) inference performance is increasingly bottlenecked by the memory wall. While GPUs continue to scale raw compute throughput, they ...

As chiplet architectures are increasingly adopted, engineers face complex 3D interconnect designs for multi-die and stacked-die applications which traditional workflows struggle t ...

A panel of leading women in semiconductors at the 2026 Chiplet Summit discuss AI’s impact on engineering careers, mentoring ...