LONDON--(BUSINESS WIRE)--The wire bonder equipment market is expected to register a CAGR of over 3% during 2020-2024, as per the latest research report by Technavio. The report offers detailed ...

New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...

As much of the industry moves toward lead-free processes, gold wire is emerging as an alternative. For example, Palomar Technologies' Model 8000 gold ball-and-stitch thermosonic wire bonder is now ...

SAN JOSE – Kulicke & Soffa Industries Inc. remained the leader in the wire-bonder equipment market in 2002, but rivals ASM Pacific and Shinkawa are gaining ground in the arena, according to a new ...

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high speed fine pitch wedge bonders and fully automatic heavy wire bonders for the ...

FORT WASHINGTON, Pa.--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (Nasdaq:KLIC) (“K&S”) introduces two next-generation wire bonders at SEMICON China, in Shanghai. The new IConn PS and the ConnX ...

CARLSBAD, Calif.--(BUSINESS WIRE)--Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, announces its new wedge emulation technology ...

Kulicke & Soffa Industries Inc. today said Amkor Technology Inc. has ordered 65 wire bonders. K&S said the order illustrates the strengthening demand for fine pitch packages. The devices are necessary ...

Palomar Technologies released its 3470-II automatic wire bonder for gold or aluminum wire interconnect assembly used in military and aerospace applications. It is designed to enable deep access wedge ...

A recently developed software tool automatically checks for design-rule violations as locations are designated for wire bonds between die and package lead frames. Known as the Post-Layout Bond Tool, ...

ESEC furthered its plan to focus in on its core die attach and wire bonder business units, announcing today that it will combine the two and streamline its corporate structure. Juergen Steinbichler, ...