South Korean electronics manufacturer LG Innotek arrived in Orlando, Florida this week to court North American chip designers ...

Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...

A new development in chip packaging could change how AI processors are built, making them smaller, faster, and more stable in data centers.

Glass substrates are gaining attention as a structural alternative to organic build-up films/cores in advanced semiconductor ...

Thin film electronics on flexible substrates is a rapidly evolving technology that has the potential to revolutionize various industries, including healthcare, consumer electronics, and aerospace.

(Nanowerk News) Electronic waste, or e-waste, is a rapidly growing global problem, and it’s expected to worsen with the production of new kinds of flexible electronics for robotics, wearable devices, ...

Kyocera is bringing out a multilayer ceramic core substrate for semiconductor packages which are rapidly scaling in complexity as AI datacenter architectures evolve. Built from Kyocera’s proprietary ...

All of the wondrous gadgets and gizmos that have built the modern technological world come with a major drawback—they eventually end up in the trash. E-waste has been a growing problem for years, and ...

A new material for flexible electronics could enable multilayered, recyclable electronic devices and help limit e-waste. Electronic waste, or e-waste, is a rapidly growing global problem, and it's ...