Abstract: I welcome you to the fourth issue of the IEEE Communications Surveys and Tutorials in 2021. This issue includes 23 papers covering different aspects of communication networks. In particular, ...
Abstract: High temperature and temperature nonuniformity pose significant challenges in 3-D integrated circuits (3-D ICs). Numerous studies have explored thermal issues in 3-D IC floorplanning.
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This is a customizable application built on three.js that allows users to design an interior space such as a home or apartment.
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